F4BTMS1000 PCB 2-Layer 6.35mm Thick High Thermal Conductivity for Aerospace and RF Feed Networks

1.Overview of the F4BTMS Series

The F4BTMS series represents an enhanced version of the F4BTM series, achieving significant advancements in material formulation and manufacturing processes. This upgraded material integrates a substantial amount of ceramics and is reinforced with ultra-thin, ultra-fine glass fiber cloth, leading to considerable improvements in performance and a wider range of dielectric constants. It is a highly reliable material ideal for aerospace applications and can effectively replace similar foreign products.

By using a minimal quantity of ultra-thin glass fiber cloth along with a large volume of uniformly distributed specialized nano-ceramics mixed with polytetrafluoroethylene resin, the series mitigates the negative impacts of glass fiber on electromagnetic wave propagation. This results in reduced dielectric loss, improved dimensional stability, and lower X/Y/Z anisotropy. Furthermore, it enhances the usable frequency range, electrical strength, and thermal conductivity, while also exhibiting a low thermal expansion coefficient and stable dielectric temperature characteristics.

A standard feature of the F4BTMS series is the RTF low roughness copper foil, which minimizes conductor loss and offers excellent peel strength. The material is compatible with both copper and aluminum substrates.

2. Features (F4BTMS1000)

Dielectric constant (Dk): 10.2 at 10GHz
Dissipation factor: 0.0020 at 10GHz; 0.0023 at 20GHz
- Coefficient of Thermal Expansion (CTE):
- X-axis: 16 ppm/°C
- Y-axis: 18 ppm/°C
- Z-axis: 32 ppm/°C
- Temperature range: -55°C to 288°C
- Low thermal coefficient of Dk: -320 ppm/°C (from -55°C to 150°C)
- High thermal conductivity: 0.81 W/mK
- Low moisture absorption: 0.03%

3. PCB Stackup

- Configuration: 2-layer rigid PCB
- Copper Layer 1: 35 µm
- F4BTMS1000 Core: 6.35 mm (250 mil)
- Copper Layer 2: 35 µm

4. PCB Construction Details

- Board dimensions: 98mm x 98mm (1 piece), ± 0.15mm tolerance
- Minimum trace/space: 6/6 mils
- Minimum hole size: 0.6mm
- No blind vias
- Finished board thickness: 6.4mm
- Finished copper weight: 1 oz (1.4 mils) on outer layers
- Via plating thickness: 20 µm
- Surface finish: Bare copper
-Top Silkscreen: White
-Bottom Silkscreen: None
-Top Solder Mask: None
-Bottom Solder Mask: None
-100% electrical testing conducted prior to shipment

5. PCB Statistics

-Components: 28
-Total Pads :58
-Through Hole Pads: 27
-Top SMT Pads :31
-Bottom SMT Pads: 0
-Vias :35
-Nets: 2

6.Type of Artwork Supplied

- Gerber RS-274-X

7. Quality Standard

- IPC-Class-2

8.Availability

- Worldwide

9. Typical Applications

- Aerospace equipment, space and cabin equipment
- Microwave and RF applications
- Radar and military radar systems
- Feed networks
- Phase-sensitive antennas and phased array antennas
- Satellite communications, among others